Invention Grant
- Patent Title: Liquid ejecting apparatus
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Application No.: US14086487Application Date: 2013-11-21
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Publication No.: US10682858B2Publication Date: 2020-06-16
- Inventor: Keiichiro Yoshino , Akira Shinoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@686864d0
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejecting apparatus includes a liquid ejecting head which ejects a liquid from a plurality of nozzles disposed on a nozzle surface; an absorbing member which makes contact with the nozzle surface and can absorb a liquid which is adhered to the nozzle surface; and a pressing member which causes the ink absorbing member to contact the nozzle surface by pressing the absorbing member from a side which opposes a side which contacts the nozzle surface. In the liquid ejecting apparatus, a pressure applied to a nozzle peripheral region within the nozzle surface due to the absorbing member which is pressed by the pressing member making contact with the nozzle surface is smaller than a pressure applied to a region other than the nozzle peripheral region within the nozzle surface.
Public/Granted literature
- US20140152740A1 LIQUID EJECTING APPARATUS Public/Granted day:2014-06-05
Information query
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