Invention Grant
- Patent Title: Three-dimensional formation platform
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Application No.: US15725251Application Date: 2017-10-04
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Publication No.: US10682813B2Publication Date: 2020-06-16
- Inventor: Chi-Chieh Wu
- Applicant: XYZPRINTING, INC. , KINPO ELECTRONICS, INC.
- Applicant Address: TW New Taipei TW New Taipei
- Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee: XYZPRINTING, INC.,KINPO ELECTRONICS, INC.
- Current Assignee Address: TW New Taipei TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@22eb03d5
- Main IPC: B29C64/245
- IPC: B29C64/245 ; B33Y30/00

Abstract:
A three-dimensional formation platform includes: a base (100), formed with a pair of guide slots (110); a carrier (200), stacked on the base (100) and clamped between the pair of guide slots (110); an elastic stopping unit (300) and an elastic pushing unit (400), disposed at two ends of the pair of guide slots (110) and abutted against the carrier (200). The elastic stopping unit (300) can be compressed for releasing the carrier (200), the elastic pushing unit (400) can provide an elastic force towards the elastic stopping unit (300), so that the carrier (200) can be displaced in a direction opposite to an installing direction (IN) for being released from the guide slot (110), a flange (210) corresponding to the guide slot (110) is extended from a portion defined at a lateral edge (203/204) of the carrier (200), and the flange (210) is received in the guide slot (110).
Public/Granted literature
- US20190061244A1 THREE-DIMENSIONAL FORMATION PLATFORM Public/Granted day:2019-02-28
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