Invention Grant
- Patent Title: High modulus spunbond
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Application No.: US15492596Application Date: 2017-04-20
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Publication No.: US10682795B2Publication Date: 2020-06-16
- Inventor: Doug Clark , Hoa Pham
- Applicant: FREUDENBERG PERFORMANCE MATERIALS LP
- Applicant Address: US NC Durham
- Assignee: FREUDENBERG PERFORMANCE MATERIALS LP
- Current Assignee: FREUDENBERG PERFORMANCE MATERIALS LP
- Current Assignee Address: US NC Durham
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: B29C48/00
- IPC: B29C48/00 ; B29C43/24 ; B29C43/00 ; D01D4/02 ; D01F6/62 ; B29C48/05 ; B29C48/30 ; B29C48/345 ; D04H3/16 ; D04H3/14 ; D01D5/098 ; D01F6/84 ; D01D5/08 ; B29C43/52 ; B29K67/00 ; B29L31/00
Abstract:
The present invention is directed at a relatively high modulus spunbond nonwoven material that is suitable for use in relatively high deep draw molding applications.
Public/Granted literature
- US20180304514A1 HIGH MODULUS SPUNBOND Public/Granted day:2018-10-25
Information query
