Invention Grant
- Patent Title: Cutting tool
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Application No.: US15779532Application Date: 2016-11-28
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Publication No.: US10682707B2Publication Date: 2020-06-16
- Inventor: Yoshikazu Kodama , Hayato Kubo , Tadashi Katsuma , Kensaku Watanabe , Kenji Kumai
- Applicant: Kyocera Corporation
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Viering, Jentschura & Partner MBB
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f3553f6
- International Application: PCT/JP2016/085150 WO 20161128
- International Announcement: WO2017/090765 WO 20170601
- Main IPC: B23B27/14
- IPC: B23B27/14 ; C23C16/36 ; C23C16/40 ; B23B27/16 ; B22F1/00 ; B22F3/10 ; C22C29/06 ; C22C29/10

Abstract:
In an aspect of the disclosure, a cutting tool includes a base member and a coating layer located on a surface of the base member. The coating layer includes a lower layer, an upper layer, and an intermediate layer located between the lower layer and the upper layer. The intermediate layer includes a first layer, a second layer, and a third layer. The first layer contains TiCx1Ny1Oz1 (0≤x1 z3 and z2>z3.
Public/Granted literature
- US20180369926A1 CUTTING TOOL Public/Granted day:2018-12-27
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