Invention Grant
- Patent Title: Removable module adapter for modular electronic system
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Application No.: US16144454Application Date: 2018-09-27
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Publication No.: US10674620B2Publication Date: 2020-06-02
- Inventor: Vic Hong Chia , Edward John Kliewer
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agent Cindy Kaplan
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/00 ; H04L12/933 ; H04L12/935 ; H05K7/14

Abstract:
In one embodiment, an apparatus includes a module adapter comprising a first connector for connection to a modular electronic system and a second connector for connection to a module inserted into a chassis of the modular electronic system to couple the module with the modular electronic system. The module adapter is removably inserted into the chassis of the modular electronic system with an adapter tool operable to lock the module adapter in place in the chassis. A method for insertion of the module adapter is also disclosed herein.
Public/Granted literature
- US20200107461A1 REMOVABLE MODULE ADAPTER FOR MODULAR ELECTRONIC SYSTEM Public/Granted day:2020-04-02
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