Disclosed is a method of reducing the thickness of an electronic circuit comprising a printed circuit and electronic components. The method includes the following operations: mounting electronic components in die form on the printed circuit, putting an insulating layer into place on the electronic components, and putting a conductive layer on the insulating layer. Various embodiments include an electronic circuit obtained by such a method; a thin plastic card, such as in a credit card format, including such an electronic circuit; and a bank card including such an electronic circuit.