Invention Grant
- Patent Title: Amplifiers with in-package radial stub harmonic traps
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Application No.: US15832470Application Date: 2017-12-05
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Publication No.: US10673387B2Publication Date: 2020-06-02
- Inventor: Ramanujam Srindhi Embar , Roy McLaren
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H03F3/195 ; H03F1/48 ; H03F3/24 ; H03F1/56 ; H01L23/66 ; H03F3/213 ; H03F3/60 ; H01L23/498 ; H01L49/02 ; H01L29/20

Abstract:
An amplifier package may include a transistor, an output impedance matching circuit and one or more radial stub harmonic traps coupled to a control terminal of the transistor or to an output terminal of the transistor. The output impedance matching circuit and the radial stub harmonic traps may be formed on a single substrate or separate substrates, which may be formed from gallium nitride. Each radial stub harmonic trap may provide a low resistance path to ground for signal energy above a fundamental operating frequency of the amplifier, such as harmonic frequencies thereof.
Public/Granted literature
- US20190173431A1 AMPLIFIERS WITH IN-PACKAGE RADIAL STUB HARMONIC TRAPS Public/Granted day:2019-06-06
Information query
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