A device of the present disclosure includes an electronic component, a metal plate, a housing, and a wavelength selective heat radiating member. The metal plate is thermally coupled to the electronic component. The housing houses the electronic component and the metal plate. The wavelength selective heat radiating member is mounted on a surface of the metal plate, so as to face an inner side surface of a specific portion of the housing. The wavelength selective heat radiating member is configured to convert thermal energy from the electronic component into heat radiation having a wavelength that penetrates the specific portion of the housing, and emit the heat radiation toward the inner side surface of the specific portion of the housing.