Invention Grant
- Patent Title: Imaging element, method of manufacturing imaging element, and imaging device
-
Application No.: US16302743Application Date: 2017-05-16
-
Publication No.: US10672837B2Publication Date: 2020-06-02
- Inventor: Hajime Kobayashi , Yuichi Tokita
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5cc4e3b1
- International Application: PCT/JP2017/018343 WO 20170516
- International Announcement: WO2017/208806 WO 20171207
- Main IPC: H01L27/30
- IPC: H01L27/30 ; H01L51/00 ; H01L51/42 ; H01L27/28 ; H01L23/522 ; H01L27/146 ; H01L21/768 ; H01L31/10 ; H01L21/3205 ; H04N5/369

Abstract:
An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and provided between the first electrode and the second electrode, in which the photoelectric conversion layer has an exciton charge separation rate of 1×1010 s−1 to 1×1016 s−1 both inclusive in a p-n junction surface formed by the p-type semiconductor and the n-type semiconductor.
Public/Granted literature
- US20190296086A1 IMAGING ELEMENT, METHOD OF MANUFACTURING IMAGING ELEMENT, AND IMAGING DEVICE Public/Granted day:2019-09-26
Information query
IPC分类: