Invention Grant
- Patent Title: Sensor chip and electronic device
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Application No.: US16329464Application Date: 2017-11-15
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Publication No.: US10672818B2Publication Date: 2020-06-02
- Inventor: Akira Tanaka , Yusuke Otake , Toshifumi Wakano
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3f5cef77
- International Application: PCT/JP2017/041010 WO 20171115
- International Announcement: WO2018/101033 WO 20180607
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/107 ; H01L31/0232

Abstract:
An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.
Public/Granted literature
- US20190252442A1 SENSOR CHIP AND ELECTRONIC DEVICE Public/Granted day:2019-08-15
Information query
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