In some embodiments, a device includes a thermal-electrical-mechanical (TEM) chip having a functional circuit, a first die attached to a first side of the TEM chip, and a first via on the first side of the TEM chip and adjacent to the first die, the first via being electrically coupled to the TEM chip. The device also includes a first molding layer surrounding the TEM chip, the first die and the first via, where an upper surface of the first die and an upper surface of the first via are level with an upper surface of the first molding layer. The device further includes a first redistribution layer over the upper surface of the first molding layer and electrically coupled to the first via and the first die.