Invention Grant
- Patent Title: Embedded features for interlocks using additive manufacturing
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Application No.: US16244623Application Date: 2019-01-10
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Publication No.: US10672634B2Publication Date: 2020-06-02
- Inventor: Craig R. Chaney , Adam M. McLaughlin
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Agency: Nields, Lemack & Frame, LLC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C14/48 ; G08B21/18 ; H01J37/317 ; H01J37/16 ; B33Y80/00

Abstract:
The present disclosure describes a method and apparatus for determining whether components in a semiconductor manufacturing system are authorized for use in that system. By embedding an identification feature in the component, it is possible for a controller to determine whether that component is qualified for use in the system. Upon detection of an unauthorized component, the system may alert the user or, in certain embodiments, stop operating of the system. This identification feature is embedded in a component by using an additive manufacturing process that allows the identification feature to be embedded in the component without subjecting the identification feature to extreme temperatures.
Public/Granted literature
- US20190252226A1 Embedded Features For Interlocks Using Additive Manufacturing Public/Granted day:2019-08-15
Information query
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