Invention Grant
- Patent Title: Electronic device
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Application No.: US16375319Application Date: 2019-04-04
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Publication No.: US10667442B2Publication Date: 2020-05-26
- Inventor: Munefumi Nakata , Seiji Yamasaki
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: LENOVO SINGAPORE PTE LTD
- Current Assignee: LENOVO SINGAPORE PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Russell Ng PLLC
- Agent Antony P. Ng
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@785732a1
- Main IPC: H05K9/00
- IPC: H05K9/00 ; G06F1/20

Abstract:
An electronic device having a shield structure is disclosed. The shield structure includes a conductive heat diffusion plate that is provided in a position facing a mounting surface of an electronic circuit board on which electronic components, such as a CPU, are mounted, and diffuses heat generated from the CPU, etc.; and a conductive sponge-like member that is firmly fixed to at least either the mounting surface of the electronic circuit board or a surface of the conductive heat diffusion plate which faces the mounting surface of the electronic circuit board, and is provided to separate the CPU, etc. which generate electromagnetic wave noise from antennas.
Public/Granted literature
- US20190380231A1 ELECTRONIC DEVICE Public/Granted day:2019-12-12
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