A high frequency module includes a plurality of components on an upper surface of a multilayer wiring substrate, a sealing resin layer on the upper surface of the multilayer wiring substrate, a shield wall surrounding one of the components within the sealing resin layer, and a shield film on an upper surface of the sealing resin layer. The shield film covers a portion of the upper surface of the sealing resin layer that overlaps the one of the components but not the other components viewed from a direction perpendicular to the upper surface of the multilayer wiring substrate. An upper end of the shield wall is exposed from the upper surface of the sealing resin layer to be connected to the shield film, and a lower end thereof is exposed from a lower surface of the sealing resin layer to be connected to the multilayer wiring substrate.