Invention Grant
- Patent Title: Semiconductor package
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Application No.: US16206070Application Date: 2018-11-30
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Publication No.: US10666249B2Publication Date: 2020-05-26
- Inventor: Dae Hoon Na , Seon Kyoo Lee , Jeong Don Ihm , Byung Hoon Jeong , Young Don Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@417fb29
- Main IPC: G11C8/12
- IPC: G11C8/12 ; H01L25/065 ; H03K17/22 ; H01L23/48

Abstract:
A semiconductor package including a first master-slave status circuit configured to store one of a first signal or a second signal independently from a second master-slave status circuit, store the first signal in response to receiving a first initial signal from a first initialization circuit, the second master-slave status circuit configured to store one of the first signal or the second signal, store the first signal in response to receiving a second initial signal from a second initialization circuit, the first initialization circuit configured to provide the first initial signal to the first master-slave status circuit, the second initialization circuit configured to provide the second initial signal to the second master-slave status circuit, and a first master-slave determination circuit connected to the second master-slave status circuit, the first master-slave determination circuit configured to provide the second signal to the second master-slave status circuit may be provided.
Public/Granted literature
- US20200014383A1 SEMICONDUCTOR PACKAGE Public/Granted day:2020-01-09
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