An elastic wave device includes a substrate including a piezoelectric film, a first IDT electrode, a first external electrode, and a first through via electrode. The first IDT electrode is provided on a first main surface of the substrate and includes a first busbar and first electrode fingers extending from the first busbar. The first external electrode is provided on a second main surface of the substrate. The first through via electrode penetrates the substrate from the first main surface to the second main surface and electrically connects the first IDT electrode and the first external electrode to each other. At least a portion of the first through via electrode overlaps the first busbar in a plan view from the first main surface side and is disposed below the first busbar.