Invention Grant
- Patent Title: Highly integrated high voltage actuator driver
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Application No.: US16483075Application Date: 2018-02-02
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Publication No.: US10666145B2Publication Date: 2020-05-26
- Inventor: Simon Chaput , Gu-Yeon Wei
- Applicant: President and Fellows of Harvard College
- Applicant Address: US MA Cambridge
- Assignee: President and Fellows of Harvard College
- Current Assignee: President and Fellows of Harvard College
- Current Assignee Address: US MA Cambridge
- Agency: Sheehan Phinney Bass & Green PA
- Agent Peter A. Kneves
- International Application: PCT/US2018/016646 WO 20180202
- International Announcement: WO2018/144866 WO 20180809
- Main IPC: H02M3/158
- IPC: H02M3/158 ; H01L41/04 ; H02M1/08 ; H02M3/157 ; H02M3/335 ; H03M1/46 ; H02M1/00 ; H02N1/00 ; H02N2/06
Abstract:
A single die driver integrated circuit is coupled to an input portion having a single inductor receiving a low voltage source and configured to drive a capacitive load with an output voltage. The driver includes a bidirectional synchronous power converter stage configured to generate a switching voltage from the input portion at a switching node and to generate a high voltage waveform from the low-voltage source. An embedded controller is configured to control a switch of the power converter stage.
Public/Granted literature
- US20190379288A1 Highly Integrated High Voltage Actuator Driver Public/Granted day:2019-12-12
Information query
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