Invention Grant
- Patent Title: GaN material and method of manufacturing semiconductor device
-
Application No.: US16284323Application Date: 2019-02-25
-
Publication No.: US10665683B2Publication Date: 2020-05-26
- Inventor: Fumimasa Horikiri
- Applicant: SCIOCS COMPANY LIMITED , SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Ibaraki JP Tokyo
- Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SCIOCS COMPANY LIMITED,SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Ibaraki JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@131aa0ac
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/36 ; H01L21/02 ; H01L21/20

Abstract:
There is provided a new technology for anodic oxidation etching performed to GaN material having arithmetic mean line roughness Ra of 15 nm or less at a measurement length of 100 μm on a bottom surface of a recess when anodic oxidation etching is performed at an etching voltage of 1 V while irradiating the GaN material with UV light to form the recess of 2 μm in depth.
Public/Granted literature
- US20190273137A1 GaN MATERIAL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-09-05
Information query
IPC分类: