Invention Grant
- Patent Title: Thin film transistor substrate and method of manufacturing thin film transistor substrate
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Application No.: US16020290Application Date: 2018-06-27
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Publication No.: US10665616B2Publication Date: 2020-05-26
- Inventor: Kazunori Inoue , Koji Oda , Kensuke Nagayama
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@281587c6
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L27/12 ; G02F1/1337 ; G02F1/1335 ; G02F1/1343 ; G02F1/1339 ; H01L29/423 ; H01L29/417 ; G09G3/36 ; G02F1/1368 ; H01L29/786 ; G02F1/1362

Abstract:
A TFT substrate includes: a first semiconductor layer made of a-Si, disposed on a gate insulation layer, facing to a first gate electrode; a first and a second contact layers made of oxide having semiconductor characteristics and each partially disposed in contact with the first semiconductor layer; a first and a second electrodes connected with the first and the second contact layers, respectively; a second semiconductor layer having the same composition as the first contact layer, disposed on the gate insulation layer, facing to a second gate electrode; a third and a fourth electrodes having the same composition as the first electrode and each partially disposed in contact with the second semiconductor layer; and a pixel electrode made of oxide having conductive characteristics and the same composition as the first contact layer, disposed on an insulation layer in a first region, connected with the second electrode.
Public/Granted literature
- US20190013333A1 THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE Public/Granted day:2019-01-10
Information query
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