Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16284036Application Date: 2019-02-25
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Publication No.: US10665608B2Publication Date: 2020-05-26
- Inventor: Tomonari Shioda , Junya Fujita , Takayuki Ito
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@13418bda
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; G11C5/06 ; H01L27/1157

Abstract:
A semiconductor device according to an embodiment includes a substrate. A transistor includes a source layer and a drain layer that are provided in a surface region of the substrate and contain impurities. A gate dielectric film is provided on the substrate between the source layer and the drain layer. A gate electrode is provided on the gate dielectric film. A first epitaxial layer is provided on the source layer or the drain layer. A second epitaxial layer is provided on the first epitaxial layer and contains both the impurities and carbon. A contact plug is provided on the second epitaxial layer. A memory cell array is provided above the transistor.
Information query
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