Invention Grant
- Patent Title: Semiconductor device having electrode pads arranged between groups of external electrodes
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Application No.: US16161561Application Date: 2018-10-16
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Publication No.: US10665518B2Publication Date: 2020-05-26
- Inventor: Kunihiro Komiya
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Ukyo-Ku, Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Ukyo-Ku, Kyoto
- Agency: Cantor Colburn LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@56601174
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/50 ; H01L23/528 ; H01L23/532
Abstract:
The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.
Public/Granted literature
- US20190051572A1 SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS OF EXTERNAL ELECTRODES Public/Granted day:2019-02-14
Information query
IPC分类:
