Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US15050685Application Date: 2016-02-23
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Publication No.: US10665436B2Publication Date: 2020-05-26
- Inventor: Takashi Uemura , Susumu Tauchi , Kohei Satou
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@470f163d
- Main IPC: C23F1/08
- IPC: C23F1/08 ; H01J37/32 ; H01L21/67

Abstract:
A plasma processing apparatus has a vacuum container having a processing chamber in which a wafer is processed by plasma and at least one member constituting the vacuum container movable and detachable in a horizontal direction with respect to a base plate. The plasma processing apparatus includes a lifter arranged at a side of the vacuum container across the vacuum container on the base plate, coupled to an end portion on the opposite side of a vacuum transfer chamber on which the wafer is transferred in a decompressed interior, and having a vertical shaft to move the detachable member vertically. The lifter includes: a coupling portion coupled to the vertical shaft and the detachable member and moved along the vertical shaft; and a turning shaft being a joint portion arranged at the coupling portion and having a vertical rotational shaft, the detachable member being horizontally turned around the turning shaft.
Public/Granted literature
- US20160372305A1 PLASMA PROCESSING APPARATUS Public/Granted day:2016-12-22
Information query
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