Invention Grant
- Patent Title: Pattern measuring method and pattern measuring apparatus
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Application No.: US16046461Application Date: 2018-07-26
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Publication No.: US10665424B2Publication Date: 2020-05-26
- Inventor: Hiroki Kawada , Takahiro Kawasaki , Junichi Kakuta
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59160e77
- Main IPC: H01J37/28
- IPC: H01J37/28 ; H01L21/67 ; H01L21/66 ; G06T7/00 ; G03F7/20 ; G06T7/13

Abstract:
A pattern measuring method and a pattern measuring apparatus that efficiently prevent a measurement error inherent to a device that performs beam scanning in a specific direction such as a scanning electron microscope are provided. The invention is directed to a pattern measuring method and a pattern measuring apparatus in which a first curve with respect to an edge of one side and a second curve with respect to an edge of the other side are obtained by calculating a first power spectral density with respect to the edge of one side of a pattern and a second power spectral density with respect to the edge of the other side of the pattern based upon a signal that is obtained when a charged particle beam is scanned in a direction intersecting the edge of the pattern; a difference value between the first curve and the second curve is calculated; and one of the first curve and the second curve is corrected by using the difference value.
Public/Granted literature
- US20190066973A1 Pattern Measuring Method and Pattern Measuring Apparatus Public/Granted day:2019-02-28
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