Invention Grant
- Patent Title: High tolerance connection between elements
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Application No.: US16412078Application Date: 2019-05-14
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Publication No.: US10664019B2Publication Date: 2020-05-26
- Inventor: Scott A. Myers , Mattia Pascolini , Richard Hung Minh Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Yew Tan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/42 ; H05K5/02 ; G06F1/16 ; H04M1/02 ; H05K5/03 ; H01Q1/22

Abstract:
This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
Public/Granted literature
- US20190269027A1 HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS Public/Granted day:2019-08-29
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