Invention Grant
- Patent Title: Epoxy resin molding material for sealing and electronic component device
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Application No.: US15404224Application Date: 2017-01-12
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Publication No.: US10662315B2Publication Date: 2020-05-26
- Inventor: Mitsuyoshi Hamada , Fumio Furusawa , Ryoichi Ikezawa , Keizo Takemiya , Toru Baba
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3e688228 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5428ee0b
- Main IPC: C08K7/18
- IPC: C08K7/18 ; H01L23/29 ; C08G59/06 ; C08G59/68 ; C08L63/00 ; C08G59/62 ; C08G59/08 ; C09K3/10 ; C08K3/36
Abstract:
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
Public/Granted literature
- US20170121505A1 EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE Public/Granted day:2017-05-04
Information query
