Invention Grant
- Patent Title: Bead core formation device
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Application No.: US15510899Application Date: 2014-09-17
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Publication No.: US10661519B2Publication Date: 2020-05-26
- Inventor: Hidetoshi Shibuya
- Applicant: FUJI SEIKO CO., LTD. , FUJI SHOJI CO., LTD.
- Applicant Address: JP JP
- Assignee: FUJI SEIKO CO., LTD.,FUJI SHOJI CO., LTD.
- Current Assignee: FUJI SEIKO CO., LTD.,FUJI SHOJI CO., LTD.
- Current Assignee Address: JP JP
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- International Application: PCT/JP2014/074527 WO 20140917
- International Announcement: WO2016/042616 WO 20160324
- Main IPC: B29D30/48
- IPC: B29D30/48 ; B65H51/22

Abstract:
A bead core formation apparatus includes a rubber coating device that coats a circumferential surface of a steel wire with rubber, and two cooling rollers around which the rubber-coated wire, which is a steel wire coated with rubber, is wound. The second roller includes a first groove and a second groove around which the rubber-coated wire located at a downstream side of the first groove is wound. The diameter LB of a portion including the second groove is smaller than the diameter LC of a portion including the first groove.
Public/Granted literature
- US20170282472A1 BEAD CORE FORMATION DEVICE Public/Granted day:2017-10-05
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