An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap.