Exemplary embodiments disclosed herein provide a back pan cooling assembly for an electronic display having a rear pan. A cooling back pan is preferably positioned behind the rear pan, the space between the cooling back pan and the rear pan defining a gap. A fan is positioned to cause a flow of ambient air through the gap. An electronic component for driving the electronic display may be placed in conductive thermal communication with the cooling back pan. A rear cover can be placed against the cooling back pan to define a sealed compartment which does not permit ambient air to enter. A port can be provided within the rear cover which allows ambient air to travel between the surroundings, the fan, and the gap.