Invention Grant
- Patent Title: Methods for connecting inter-layer conductors and components in 3D structures
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Application No.: US15185078Application Date: 2016-06-17
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Publication No.: US10660214B2Publication Date: 2020-05-19
- Inventor: Ryan B. Wicker , Francisco Medina , Eric MacDonald , Danny W. Muse , David Espalin
- Applicant: Board of Regents, The University of Texas System
- Applicant Address: US TX Austin
- Assignee: Board of Regents, The University of Texas System
- Current Assignee: Board of Regents, The University of Texas System
- Current Assignee Address: US TX Austin
- Agency: Yee & Associates, P.C.
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K3/10 ; H05K1/02 ; H01L23/00 ; B33Y80/00 ; H05K3/32 ; H05K3/34
Abstract:
Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
Public/Granted literature
- US20160324009A1 METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES Public/Granted day:2016-11-03
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