Invention Grant
- Patent Title: Elastic wave device
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Application No.: US15831471Application Date: 2017-12-05
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Publication No.: US10659001B2Publication Date: 2020-05-19
- Inventor: Koji Yamamoto , Tsutomu Takai , Seiji Kai , Hisashi Yamazaki , Yuji Miwa , Takashi Yamane
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7337aba0
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/10 ; H03H9/64 ; H03H9/145 ; H03H9/25

Abstract:
An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
Public/Granted literature
- US20180097502A1 ELASTIC WAVE DEVICE Public/Granted day:2018-04-05
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