Invention Grant
- Patent Title: Evaporation plate for depositing deposition material on substrate, evaporation apparatus, and method of depositing deposition material on substrate
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Application No.: US16300186Application Date: 2017-11-01
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Publication No.: US10658630B2Publication Date: 2020-05-19
- Inventor: Gu Yao , Qinghua Zou , Tingyuan Duan
- Applicant: BOE Technology Group Co., Ltd. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Hefei, Anhui
- Assignee: BOE Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Hefei, Anhui
- Agency: Intellectual Valley Law, P.C.
- International Application: PCT/CN2017/108910 WO 20171101
- International Announcement: WO2019/084840 WO 20190509
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/50 ; H01L27/32 ; H01L51/00 ; C23C14/54 ; C23C14/24 ; C23C14/04

Abstract:
The present application discloses an evaporation plate for depositing a deposition material on a substrate. The evaporation plate has a first side and a second side opposite to the first side. The evaporation plate includes a main body plate; a first cooling layer on the main body plate and on the first side of the evaporation plate; and a first heating layer on a side of the first cooling layer distal to the main body plate. The first cooling layer is configured to cool the first heating layer on the first side of the evaporation plate. The first heating layer is configured to heat a material deposited on the first side of the evaporation plate.
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