Invention Grant
- Patent Title: Ultrasound transducer and manufacturing method thereof
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Application No.: US15643226Application Date: 2017-07-06
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Publication No.: US10658563B2Publication Date: 2020-05-19
- Inventor: DuYeop Kim , KyungHo Lee , SeungHee Lee
- Applicant: Siemens Medical Solutions USA, Inc.
- Applicant Address: US PA Malvern
- Assignee: Siemens Medical Solutions USA, Inc.
- Current Assignee: Siemens Medical Solutions USA, Inc.
- Current Assignee Address: US PA Malvern
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e36e560
- Main IPC: B06B1/06
- IPC: B06B1/06 ; H01L41/04 ; H01L41/047 ; B06B1/02 ; H01L41/053 ; H01L41/293 ; H01L41/31

Abstract:
An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.
Public/Granted literature
- US20180033945A1 Ultrasound Transducer and Manufacturing Method Thereof Public/Granted day:2018-02-01
Information query
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