Invention Grant
- Patent Title: Semiconductor device including diode structure
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Application No.: US16160104Application Date: 2018-10-15
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Publication No.: US10658498B2Publication Date: 2020-05-19
- Inventor: Yasuhiro Hirabayashi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya-shi
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya-shi
- Agency: Hunton Andrews Kurth LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@70f5cdd4
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L27/07 ; H01L29/861 ; H01L29/10 ; H01L29/08 ; H01L29/417 ; H01L29/423 ; H01L29/06 ; H01L29/40 ; H01L29/16

Abstract:
A semiconductor device may include a semiconductor substrate, an upper electrode and a lower electrode. The semiconductor substrate may include: a p-type anode region being in contact with the upper electrode; an n-type cathode region being in contact with the lower electrode; an n-type drift region interposed between the anode region and the cathode region. The semiconductor substrate may further include a barrier region interposed between the anode region and the drift region; and an n-type pillar region extending between the barrier region and the upper electrode. The barrier region may include a multi-layer structure in which a p-type second barrier layer is interposed between an n-type first barrier layer and an n-type third barrier layer. The first barrier layer may be in contact with the anode region and is connected to the upper electrode via the pillar region.
Public/Granted literature
- US20190115460A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-04-18
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