Invention Grant
- Patent Title: Nanosheet transistor with robust source/drain isolation from substrate
-
Application No.: US16545867Application Date: 2019-08-20
-
Publication No.: US10658459B2Publication Date: 2020-05-19
- Inventor: Robin Hsin Kuo Chao , Kangguo Cheng , Cheng Chi , Ruilong Xie , John H. Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Joseph Petrokaitis
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/775 ; H01L29/66

Abstract:
A substrate structure for a nanosheet transistor includes a plurality of nanosheet layers and a plurality of recesses between the nanosheet layers. The substrate structure includes at least one trench through portions of the nanosheet layers, the sacrificial layers, and the substrate. The substrate structure includes a u-shaped portion formed at a bottom portion of the at least one trench. The u-shaped portion includes a bottom cavity. The substrate structure further includes a first liner disposed upon the u-shaped portion of the at least one trench, and a second liner disposed on the first liner. The substrate structure further includes a third liner disposed within the at least one trench to fill the bottom cavity of the u-shaped portion to form a bottom inner spacer within the bottom cavity.
Public/Granted literature
- US20200006476A1 NANOSHEET TRANSISTOR WITH ROBUST SOURCE/DRAIN ISOLATION FROM SUBSTRATE Public/Granted day:2020-01-02
Information query
IPC分类: