- Patent Title: Metal insulator metal capacitor structure having high capacitance
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Application No.: US15906724Application Date: 2018-02-27
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Publication No.: US10658455B2Publication Date: 2020-05-19
- Inventor: Chen-Yin Hsu , Chun Li Wu , Ching-Hung Kao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L49/02
- IPC: H01L49/02

Abstract:
The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a MIM dual capacitor structure with an increased capacitance per unit area in a semiconductor structure. Without using additional mask layers, a second parallel plate capacitor can be formed over a first parallel plate capacitor, and both capacitors share a common capacitor plate. The two parallel plate capacitors can be connected in parallel to increase the capacitance per unit area.
Public/Granted literature
- US20190096986A1 METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE Public/Granted day:2019-03-28
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