Invention Grant
- Patent Title: High-density field-enhanced ReRAM integrated with vertical transistors
-
Application No.: US16289867Application Date: 2019-03-01
-
Publication No.: US10658429B2Publication Date: 2020-05-19
- Inventor: Takashi Ando , Pouya Hashemi , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L29/66 ; H01L45/00 ; H01L29/49 ; H01L29/40 ; H01L29/775 ; H01L29/06 ; B82Y10/00 ; H01L29/417 ; H01L29/08 ; H01L29/423

Abstract:
A method is presented for integrating a resistive random access memory (ReRAM) device with vertical transistors on a single chip. The method includes forming a vertical field effect transistor (FET) including an epitaxial tip defining a drain terminal and forming the ReRAM device in direct contact with the epitaxial tip of the vertical FET such that a current conducting filament is formed at the epitaxial tip due to electric field enhancement.
Public/Granted literature
- US20190198572A1 HIGH-DENSITY FIELD-ENHANCED ReRAM INTEGRATED WITH VERTICAL TRANSISTORS Public/Granted day:2019-06-27
Information query
IPC分类: