- Patent Title: Solid-state image sensor, electronic apparatus, and imaging method
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Application No.: US16213038Application Date: 2018-12-07
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Publication No.: US10658405B2Publication Date: 2020-05-19
- Inventor: Keiji Tatani , Tomoharu Ogita , Takashi Nagano
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@780ce911
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/232 ; H04N5/369 ; H04N5/3745 ; H04N9/04 ; H04N5/374 ; H04N5/378

Abstract:
The present disclosure relates to a solid-state image sensor, an electronic apparatus and an imaging method by which specific processing other than normal processing can be sped up with reduced power consumption.The solid-state image sensor includes a pixel outputting a pixel signal used to construct an image and a logic circuit driving the pixel, and is configured of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together. In addition, among the plurality of pixels, a specific pixel is connected to the logic circuit independently of a normal pixel, the specific pixel being the pixel that outputs the pixel signal used in the specific processing other than imaging processing in which the image is imaged. The present technology can be applied to a stacked solid-state image sensor, for example.
Public/Granted literature
- US20190109165A1 SOLID-STATE IMAGE SENSOR, ELECTRONIC APPARATUS, AND IMAGING METHOD Public/Granted day:2019-04-11
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