Invention Grant
- Patent Title: Stacked electrostatic discharge diode structures
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Application No.: US16113343Application Date: 2018-08-27
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Publication No.: US10658353B2Publication Date: 2020-05-19
- Inventor: Alexander Reznicek , Bahman Hekmatshoartabari , Karthik Balakrishnan , Tak Ning
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06 ; H01L23/528 ; H01L21/762 ; H01L21/768 ; H01L23/532 ; H01L29/66 ; H01L29/861
Abstract:
An electrostatic discharge (ESD) protection structure containing a bottom diode and a top diode vertically stacked on the bottom diode is provided to render sufficient protection from ESD events with reduced diode footprint. The bottom diode is serially connected to the top diode via a conductive strap structure.
Public/Granted literature
- US20190035778A1 STACKED ELECTROSTATIC DISCHARGE DIODE STRUCTURES Public/Granted day:2019-01-31
Information query
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