Invention Grant
- Patent Title: Stack packages including bridge dies
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Application No.: US16219676Application Date: 2018-12-13
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Publication No.: US10658332B2Publication Date: 2020-05-19
- Inventor: Ki Jun Sung , Jong Hoon Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46fcce03
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L23/522 ; H01L23/00 ; H01L23/538 ; H01L23/373
Abstract:
A stack package includes a second sub-package stacked on a first sub-package. The stack package also includes a plurality of dummy balls located between the first and second sub-packages to support the second sub-package. Each of the first and second sub-packages includes a semiconductor die and a bridge, die which are spaced apart from each other.
Public/Granted literature
- US20200075542A1 STACK PACKAGES INCLUDING BRIDGE DIES Public/Granted day:2020-03-05
Information query
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