Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16509159Application Date: 2019-07-11
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Publication No.: US10658317B2Publication Date: 2020-05-19
- Inventor: Koshun Saito
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a3458b3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2431fd62
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/768 ; H01L23/495 ; H01L23/31
Abstract:
A semiconductor device includes a predetermined number of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin that covers the semiconductor element and a part of each lead. Each lead includes some portions exposed from the sealing resin. A surface plating layer is formed on at least one of the exposed portions of the respective leads.
Public/Granted literature
- US20190333885A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-10-31
Information query
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