The specification discloses a technique for preventing a bonding material from reaching the upper and lower surfaces of a semiconductor chip in bonding the semiconductor chip using the bonding material. A die pad of the technique disclosed in the specification includes the following: a die pad substrate; a first projection disposed on the upper surface of the die pad substrate, the first projection having a pedestal shape; a second projection disposed on the upper surface of the die pad substrate so as to surround at least part of the first projection in a plan view, the second projection having a bank shape; and a third projection disposed on the upper surface of the die pad substrate so as to surround at least part of the second projection in a plan view, the third projection having a bank shape.