- Patent Title: Semiconductor mold compound transfer system and associated methods
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Application No.: US16257585Application Date: 2019-01-25
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Publication No.: US10658256B2Publication Date: 2020-05-19
- Inventor: Kean Tat Koh , Lien Wah Choong
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; B29C33/28 ; B29C33/30 ; B29C33/42 ; H01L21/56 ; B29C43/18 ; B29C43/00
Abstract:
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.
Public/Granted literature
- US20190157172A1 SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS Public/Granted day:2019-05-23
Information query
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