Invention Grant
- Patent Title: Process of forming semiconductor substrate by use of normalized reflectivity
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Application No.: US15982125Application Date: 2018-05-17
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Publication No.: US10658251B2Publication Date: 2020-05-19
- Inventor: Tadashi Watanabe
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Kanagawa
- Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS
- Current Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS
- Current Assignee Address: JP Kanagawa
- Agency: Smith, Gambrell & Russell, LLP.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/02 ; H01L29/66 ; H01L29/778 ; C30B29/40 ; C23C16/52 ; C30B25/18 ; C23C16/02 ; C23C16/30 ; H01L29/20

Abstract:
A process of forming an epitaxial substrate is disclosed, where the epitaxial substrate includes a nucleus forming layer made of aluminum nitride (AlN) grown on a substrate made of silicon carbide (SiC). The process includes steps of: (1) first measuring the first reflectivity R0 of a surface of the SiC substrate, (2) growing the nucleus forming layer made of AlN as measuring second reflectivity R1 of a grown surface of the AlN nucleus forming layer, and (3) ending the growth of the AlN nucleus forming layer when a ratio R1/R0 of the reflectivity enters a preset range.
Public/Granted literature
- US20180350700A1 PROCESS OF FORMING SEMICONDUCTOR SUBSTRATE Public/Granted day:2018-12-06
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