Invention Grant
- Patent Title: FinFET devices and methods of forming the same
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Application No.: US15874889Application Date: 2018-01-19
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Publication No.: US10658225B2Publication Date: 2020-05-19
- Inventor: Jih-Jse Lin , Ryan Chia-Jen Chen , Fang-Cheng Chen , Ming-Ching Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/8234 ; H01L21/764 ; H01L27/088 ; H01L21/3065 ; H01L29/66 ; H01L29/78 ; H01L21/311 ; H01L29/165

Abstract:
FinFET devices and methods of forming the same are disclosed. One of the FinFET devices includes first fins, second fins, a first gate strip, a second gate strip and a comb-like insulating structure. The first and second fins are disposed on a substrate. The first gate strip is disposed across the first fins. The second gate strip is disposed across the second fins. The comb-like insulating structure is disposed between the first gate strip and the second gate strip and has a plurality of comb tooth parts. In some embodiments, each of the comb tooth parts has a middle-wide profile.
Public/Granted literature
- US20190229010A1 FINFET DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2019-07-25
Information query
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