Invention Grant
- Patent Title: Impurity adding apparatus, impurity adding method, and semiconductor element manufacturing method
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Application No.: US15174468Application Date: 2016-06-06
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Publication No.: US10658183B2Publication Date: 2020-05-19
- Inventor: Kenichi Iguchi , Haruo Nakazawa , Masaaki Ogino
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Main IPC: H01L21/228
- IPC: H01L21/228 ; H01L21/268 ; H01L21/67 ; H01L29/16 ; H01L21/04 ; H01L21/22

Abstract:
An impurity-doping apparatus is provided with: a supporting plate which supports a semiconductor substrate; a wall-like block disposed above the supporting plate floating away from the semiconductor substrate, the wall-like block implements a recess inside so as to establish a space for a solution region containing impurity elements, the solution region is localized on an upper surface of the semiconductor substrate, the upper surface being opposite to an bottom surface facing to the supporting plate; and a laser optical system, configured to irradiate a laser beam onto the upper surface of the semiconductor substrate, through the solution region surrounded by the wall-like block, wherein the impurity elements are doped into a part of the semiconductor substrate by irradiation of the laser beam.
Public/Granted literature
- US20160284547A1 IMPURITY ADDING APPARATUS, IMPURITY ADDING METHOD, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD Public/Granted day:2016-09-29
Information query
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