Invention Grant
- Patent Title: Stage and substrate processing apparatus
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Application No.: US15526723Application Date: 2015-11-05
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Publication No.: US10658160B2Publication Date: 2020-05-19
- Inventor: Tsutomu Hiroki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@69d1b151
- International Application: PCT/JP2015/081187 WO 20151105
- International Announcement: WO2016/076201 WO 20160519
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/687 ; H01L21/3065 ; H01L21/683

Abstract:
A stage includes a plate having a top surface on which a substrate is to be placed and a bottom surface; a plurality of first tubes each extending toward different regions of the bottom surface and providing opening ends facing the bottom surface; a partition wall defining a plurality of spaces surrounding the respective first tubes, the spaces forming a plurality of flow passages through which a heat exchange medium discharged from the first tubes flows; and a plurality of second tubes connected to the partition wall to communicate with the respective flow passages. The stage further includes a plurality of adjusting mechanisms provided in the respective flow passages. Each of the adjusting mechanisms is configured to be deformed depending on the temperature of the heat exchange medium in the corresponding flow passage to adjust the conductance of the flow passage in accordance with the temperature.
Public/Granted literature
- US20170316923A1 STAGE AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-11-02
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