Invention Grant
- Patent Title: Multilayer capacitor and board having the same
-
Application No.: US16184568Application Date: 2018-11-08
-
Publication No.: US10658112B2Publication Date: 2020-05-19
- Inventor: Heung Kil Park , Jong Hwan Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwonsi, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwonsi, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@284fdd21
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232 ; H01G4/35 ; H01G4/224 ; H05K1/18 ; H05K1/02 ; H01G4/12

Abstract:
A multilayer capacitor includes a capacitor body including first and second internal electrodes disposed alternately in a width direction; first and second external electrodes spaced apart from each other on a mounting surface; and a first insulating layer disposed between the first and second external electrodes, in which the first and second internal electrodes each include a body portion, a first lead portion extending from the body portion toward the mounting surface and electrically connected to the first and second external electrodes, and a second lead portion extending from the body portion toward a surface of the capacitor body opposing the mounting surface, and the first and second lead portions extend from each body portion in a diagonal direction relative to each other.
Public/Granted literature
- US20190326056A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2019-10-24
Information query