Invention Grant
- Patent Title: Apparatus for high speed ROM cells
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Application No.: US16229072Application Date: 2018-12-21
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Publication No.: US10658010B2Publication Date: 2020-05-19
- Inventor: Jhon-Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/112
- IPC: H01L27/112 ; H01L23/522 ; G11C5/02 ; G11C5/06 ; G11C17/12 ; G11C17/18 ; H01L27/12 ; G11C17/08 ; H01L23/528

Abstract:
An apparatus comprises a plurality of memory cells in rows and columns, a first word line electrically coupled to a first group of memory cells through a first word line strap structure comprising a first gate contact, a first-level via, a first metal line and a second-level via and a second word line electrically coupled to a second group of memory cells through a second word line strap structure, wherein the second word line strap structure and the first word line strap structure are separated by at least two memory cells.
Public/Granted literature
- US20190147919A1 Apparatus for High Speed ROM Cells Public/Granted day:2019-05-16
Information query
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