A fingerprint module and an electronic apparatus are described. The fingerprint module may include: an encapsulation layer and a decoration component. The encapsulation layer may be configured to encapsulate a fingerprint identifying assembly and include a rear wall having a first mating portion. The decoration component may define an embedded groove and include a second mating portion in the embedded groove. The encapsulation layer may be embedded in the embedded groove, and the first mating portion may be embedded to the second mating portion.