Invention Grant
- Patent Title: Semiconductor apparatus and method for manufacturing semiconductor apparatus
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Application No.: US16084260Application Date: 2017-03-03
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Publication No.: US10656483B2Publication Date: 2020-05-19
- Inventor: Hiroshi Matsukizono
- Applicant: Sharp Kabushiki Kaisha
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Sakai
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@8855f4b
- International Application: PCT/JP2017/008589 WO 20170303
- International Announcement: WO2017/159413 WO 20170921
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; H01L29/66 ; G02F1/1368 ; G09F9/00 ; G09F9/30 ; H01L29/423 ; H01L29/49 ; H01L27/12 ; H01L29/786 ; G02F1/1343

Abstract:
A semiconductor apparatus (100) is provided with: a substrate (1); and a thin-film transistor (10). The thin-film transistor has: an oxide semiconductor layer (11) that includes a channel region (11a) and first and second contact regions (11b, 11c); a gate insulating layer (12) that is provided so as to cover the oxide semiconductor layer; a gate electrode (13) that is provided on the gate insulating layer and that overlaps the channel region via the gate insulating layer; a source electrode (14) that is electrically connected to the first contact region; and a drain electrode (15) that is electrically connected to the second contact region. This semiconductor apparatus is further provided with a light-shielding layer (2) arranged between the oxide semiconductor layer and the substrate, and the channel region is aligned to the part of the light-shielding layer overlapping the oxide semiconductor layer.
Public/Granted literature
- US20190155119A1 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS Public/Granted day:2019-05-23
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